TFD I/O Partition for High-Speed, High-Density Applications

ABSTRACT

A microelectronic package can include a substrate having first and second surfaces, first, second, and third microelectronic elements each having a surface facing the first surface, terminals exposed at the second surface, and leads electrically connected between contacts of each microelectronic element and the terminals. The substrate can have first, second, and third spaced-apart apertures having first, second, and third parallel axes extending in directions of the lengths of the apertures. The contacts of the first, second, and third microelectronic elements can be aligned with one of the first, second, or third apertures. The terminals can include first and second sets of first terminals configured to carry address information. The first set can be connected with the first and third microelectronic elements and not with the second microelectronic element, and the second set can be connected with the second microelectronic element and not with the first or third microelectronic elements.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a divisional of, and hereby claims priority to,pending U.S. patent application Ser. No. 15/148,726, filed May 6, 2016,the entirety of which is hereby incorporated by reference herein for allpurposes.

BACKGROUND OF THE INVENTION

The subject matter of the present application relates to microelectronicpackages, circuit panels, and microelectronic assemblies incorporatingone or more microelectronic package and a circuit panel.

Semiconductor chips are commonly provided as individual, prepackagedunits. A standard chip has a flat, rectangular body with a large frontface having contacts connected to the internal circuitry of the chip.Each individual chip typically is contained in a package having externalterminals connected to the contacts of the chip. In turn, the terminals,i.e., the external connection points of the package, are configured toelectrically connect to a circuit panel, such as a printed circuitboard. In many conventional designs, the chip package occupies an areaof the circuit panel considerably larger than the area of the chipitself. As used in this disclosure with reference to a flat chip havinga front face, the “area of the chip” should be understood as referringto the area of the front face.

Size is a significant consideration in any physical arrangement ofchips. The demand for more compact physical arrangements of chips hasbecome even more intense with the rapid progress of portable electronicdevices. Merely by way of example, devices commonly referred to as“smart phones” integrate the functions of a cellular telephone withpowerful data processors, memory, and ancillary devices such as globalpositioning system receivers, electronic cameras, and local area networkconnections along with high-resolution displays and associated imageprocessing chips. Such devices can provide capabilities such as fullinternet connectivity, entertainment including full-resolution video,navigation, electronic banking and more, all in a pocket-size device.

Complex portable devices require packing numerous chips into a smallspace. Moreover, some of the chips have many input and outputconnections, commonly referred to as “I/Os.” These I/Os must beinterconnected with the I/Os of other chips. The components that formthe interconnections should not greatly increase the size of theassembly. Similar needs arise in other applications as, for example, indata servers such as those used in internet search engines whereincreased performance and size reduction are needed.

Semiconductor chips containing memory storage arrays, particularlydynamic random access memory chips (DRAMs) and flash memory chips, arecommonly packaged in single- or multiple-chip packages and assemblies.Each package has many electrical connections for carrying signals,power, and ground between terminals and the chips therein. Theelectrical connections can include different kinds of conductors such ashorizontal conductors, e.g., traces, beam leads, etc., that extend in ahorizontal direction relative to a contact-bearing surface of a chip,vertical conductors such as vias, which extend in a vertical directionrelative to the surface of the chip, and wire bonds that extend in bothhorizontal and vertical directions relative to the surface of the chip.

Conventional microelectronic packages can incorporate a microelectronicelement that is configured to predominantly provide memory storage arrayfunction, i.e., a microelectronic element that embodies a greater numberof active devices to provide memory storage array function than anyother function. The microelectronic element may be or may include a DRAMchip, or a stacked electrically interconnected assembly of suchsemiconductor chips.

In light of the foregoing, certain improvements in the design ofmicroelectronic packages and microelectronic assemblies includingcircuit panels and/or other microelectronic components can be made inorder to improve the functional flexibility or electrical performancethereof, particularly in microelectronic packages and microelectronicassemblies having circuit panels and/or other microelectronic componentsto which microelectronic packages can be mounted and electricallyinterconnected with one another.

BRIEF SUMMARY OF THE INVENTION

A microelectronic package can include, a substrate having first andsecond opposed surfaces, first, second, and third microelectronicelements each having a surface facing the first surface of thesubstrate, terminals exposed at the second surface and configured forconnecting the microelectronic package to at least one componentexternal to the microelectronic package, and leads electricallyconnected between contacts of each microelectronic element and theterminals. The substrate can have first and second opposed edgesextending between the first and second surfaces, and first, second, andthird spaced-apart apertures each extending between the first and secondsurfaces. The apertures can have first, second, and third parallel axeseach extending in directions of the lengths of the apertures,respectively. The third axis can be disposed between the first andsecond axes. The second surface can have a central region between thefirst and second axes.

The first, second, and third microelectronic elements can each havecontacts exposed at the surface of the respective microelectronicelement and aligned with one of the first, second, or third apertures,respectively. Each microelectronic element can have memory storage arrayfunction. Each lead can have a portion aligned with at least one of theapertures. The terminals can include first terminals configured to carryaddress information. The first terminals can include first and secondsets thereof. The first set of the first terminals can be electricallyconnected with the first and third microelectronic elements and notelectrically connected with the second microelectronic element. Thesecond set of the first terminals can be electrically connected with thesecond microelectronic element and not electrically connected with thefirst or third microelectronic elements.

In one embodiment, the terminals can include second terminals configuredto carry second information. The second information can be other thanthe information carried by the first terminals. The second informationcan include data signals. The second terminals can include first,second, and third sets thereof each connected to only one of the first,second, and third microelectronic elements. In a particular example, thethird set of the second terminals can be electrically connected with thethird microelectronic element. The third set of the second terminals caninclude first and second groups disposed in the central region on firstand second opposite sides of the third aperture. In an exemplaryembodiment, the second surface of the substrate can have first andsecond peripheral regions between the central region and the respectivefirst and second edges. The first and second sets of second terminalscan be electrically connected with the respective first and secondmicroelectronic elements and can be disposed in the respective first andsecond peripheral regions.

In one example, the signal assignments of corresponding ones of thesecond terminals in the first and second sets can be symmetric about atheoretical fourth axis between the first and second sets. The fourthaxis can be parallel to the first, second, and third axes. In aparticular embodiment, the fourth axis can be located within one ballpitch of the terminals of a centerline of the substrate locatedequidistant between the first and second opposed edges. In oneembodiment, the first and second sets of the second terminals can bedisposed at positions within respective first and second grids, andcolumns of the second terminals in the first and second grids can extendin a direction parallel to the first and second opposed edges of thesubstrate. In a particular example, the first terminals can beconfigured to carry all of the address information usable by circuitrywithin the microelectronic package. In an exemplary embodiment, thefirst set of first terminals and the second set of first terminals caneach be configured to carry all of the same signals.

In one example, the signal assignments of corresponding ones of thefirst terminals in the first and second sets can be symmetric about atheoretical fourth axis between the first and second sets. The fourthaxis can be parallel to the first, second, and third axes. In aparticular embodiment, the fourth axis can be located within one ballpitch of the terminals of a centerline of the substrate locatedequidistant between the first and second opposed edges. In oneembodiment, the first and second sets of the first terminals can bedisposed at positions within respective first and second grids, andcolumns of the first terminals in the first and second grids can extendin a direction parallel to the first and second opposed edges of thesubstrate. In a particular example, each of the microelectronic elementscan embody a greater number of active devices to provide memory storagearray function than any other function.

In an exemplary embodiment, the surface of each of the first and secondmicroelectronic elements can confront the first surface of thesubstrate, and the surface of the third microelectronic element can atleast partially overlie a rear surface of at least one of the first andsecond microelectronic elements. In one example, the surfaces of all ofthe microelectronic elements can be arranged in a single plane parallelto the first surface of the substrate. In a particular embodiment, atleast some of the leads can include wire bonds extending through atleast one of the apertures. In one embodiment, a system can include amicroelectronic package as described above and one or more otherelectronic components electrically connected to the microelectronicpackage. In a particular example, the system can also include a housing,the microelectronic package and the one or more other electroniccomponents being assembled with the housing.

A microelectronic assembly can include a circuit panel having first andsecond opposed surfaces and an address bus comprising a plurality ofsignal conductors electrically connected with a plurality of mutuallyexclusive connection regions. Each connection region can include firstpanel contacts and second panel contacts electrically coupled with thefirst panel contacts disposed at the first and second surfaces,respectively. The microelectronic assembly can also include first andsecond microelectronic packages having first terminals mounted to thefirst panel contacts and the second panel contacts, respectively. Eachmicroelectronic package can have first, second, and thirdmicroelectronic elements therein.

Each microelectronic element may be electrically coupled to the addressbus via only one of the connection regions. The first and thirdmicroelectronic elements of the first microelectronic package and thesecond microelectronic element of the second microelectronic package maybe electrically coupled to the address bus only at a first one of theconnection regions. The second microelectronic elements of the firstmicroelectronic package and the first and third microelectronic elementsof the second microelectronic package may be electrically coupled to theaddress bus only at a second one of the connection regions.

In one embodiment, the address bus can be configured to carry alladdress signals usable by circuitry within the first and secondmicroelectronic packages. In a particular example, each of themicroelectronic elements can embody a greater number of active devicesto provide memory storage array function than any other function. In anexemplary embodiment, the first terminals of the first and secondmicroelectronic packages can be arranged at positions of first andsecond grids, and the first and second grids can be aligned with oneanother in x and y orthogonal directions parallel to the first andsecond surfaces of the circuit panel. The alignment can be within adistance equal to a minimum pitch between adjacent terminals of thegrids.

In one example, the microelectronic assembly can also include third andfourth microelectronic packages having first terminals mounted to thefirst panel contacts and the second panel contacts, respectively. Eachof the third and fourth microelectronic packages can have first, second,and third microelectronic elements therein. Each microelectronic elementcan be electrically coupled to the address bus via only one of theconnection regions. The first and third microelectronic elements of thethird microelectronic package and the second microelectronic element ofthe fourth microelectronic package can be electrically coupled to theaddress bus only at a third one of the connection regions. The secondmicroelectronic element of the third microelectronic package and thefirst and third microelectronic elements of the fourth microelectronicpackage can be electrically coupled to the address bus only at a fourthone of the connection regions.

An electrical characteristic between the first and second connectionregions can be within a same tolerance of the electrical characteristicbetween the second and third connection regions. In a particularembodiment, the electrical characteristic can be an electrical tracelength. In one embodiment, the electrical characteristic can be anelectrical propagation delay. In a particular example, the electricalcharacteristic can be a characteristic impedance of the signalconductors. In an exemplary embodiment, the electrical characteristiccan be a difference in an electrical load applied to the address busfrom the microelectronic elements connected with the respectiveconnection region.

A microelectronic assembly can include a circuit panel having first andsecond opposed surfaces and an address bus comprising a plurality ofsignal conductors electrically connected with a plurality of mutuallyexclusive connection regions. Each connection region can include eitheror both of first panel contacts and second panel contacts electricallycoupled with at least some of the plurality of signal conductors anddisposed at the first and second surfaces, respectively. Themicroelectronic assembly can also include first and secondmicroelectronic packages having first terminals mounted to the firstpanel contacts and the second panel contacts, respectively. Eachmicroelectronic package can have first, second, and thirdmicroelectronic elements therein.

Each microelectronic element may be electrically coupled to the addressbus via only one of the connection regions. The first and thirdmicroelectronic elements of the first microelectronic package may beelectrically coupled to the address bus only at a first one of theconnection regions. The second microelectronic element of the firstmicroelectronic package and the second microelectronic element of thesecond microelectronic package may be electrically coupled to theaddress bus only at a second one of the connection regions. The firstand third microelectronic elements of the second microelectronic packagemay be electrically coupled to the address bus only at a third one ofthe connection regions.

In one embodiment, the address bus can be configured to carry alladdress signals usable by circuitry within the first and secondmicroelectronic packages. In a particular example, each of themicroelectronic elements can embody a greater number of active devicesto provide memory storage array function than any other function. In anexemplary embodiment, an electrical characteristic between the first andsecond connection regions can be within a same tolerance of theelectrical characteristic between the second and third connectionregions. In one example, the electrical characteristic can be anelectrical trace length. In a particular embodiment, the electricalcharacteristic can be an electrical propagation delay. In oneembodiment, the electrical characteristic can be a characteristicimpedance of the signal conductors. In a particular example, theelectrical characteristic can be a difference in an electrical loadapplied to the address bus from the microelectronic elements connectedwith the respective connection region.

In an exemplary embodiment, the microelectronic assembly can alsoinclude third and fourth microelectronic packages having first terminalsmounted to the first panel contacts and the second panel contacts,respectively. Each of the third and fourth microelectronic packages canhave first, second, and third microelectronic elements therein. Eachmicroelectronic element can be electrically coupled to the address busvia only one of the connection regions. The first and thirdmicroelectronic elements of the third microelectronic package can beelectrically coupled to the address bus only at a fourth one of theconnection regions. The second microelectronic element of the thirdmicroelectronic package and the second microelectronic element of thefourth microelectronic package can be electrically coupled to theaddress bus only at a fifth one of the connection regions. The first andthird microelectronic elements of the fourth microelectronic package maynot be electrically coupled to the address bus. In one example, thefirst and third microelectronic elements of the fourth microelectronicpackage can be electrically coupled to third panel contacts disposed atthe second surface of the circuit panel, and the third panel contactsmay not be connected in any electrical path to the address bus withinthe microelectronic assembly.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a sectional view of a microelectronic assembly including amicroelectronic package and a circuit panel according to an embodimentof the present invention.

FIG. 1B is a diagrammatic plan view of the microelectronic package shownin FIG. 1A.

FIG. 1C is a diagrammatic representation of the electrical connectionsfor address signals within the microelectronic package shown in FIG. 1A.

FIG. 1D is a diagrammatic representation of the electrical connectionsfor data signals within the microelectronic package shown in FIG. 1A.

FIG. 1E is a diagrammatic plan view a microelectronic element suitablefor use in the microelectronic package shown in FIG. 1A.

FIG. 1F is a diagrammatic plan view showing potential signal assignmentsof a portion of the diagrammatic plan view shown in FIG. 1B, accordingto one embodiment.

FIG. 1G is a diagrammatic plan view showing potential signal assignmentsof a portion of the diagrammatic plan view shown in FIG. 1B, accordingto another embodiment.

FIG. 1H is a sectional view of an alternative configurations ofmicroelectronic elements of the microelectronic package shown in FIG.1A.

FIG. 2 is a diagrammatic representation of the electrical connectionsfor address signals within a microelectronic assembly including themicroelectronic package shown in FIG. 1A.

FIG. 3 is a diagrammatic representation of the electrical connectionsfor address signals within a microelectronic assembly including themicroelectronic package shown in FIG. 1A, which is a variation of themicroelectronic assembly of FIG. 2.

FIG. 4 is a diagrammatic representation of the electrical connectionsfor address signals within a microelectronic assembly including themicroelectronic package shown in FIG. 1A, which is a variation of themicroelectronic assembly of FIG. 3.

FIG. 5 is a schematic depiction of a system according to one embodimentof the invention.

DETAILED DESCRIPTION

FIGS. 1A and 1B illustrate a particular type of microelectronic package10. As seen in FIGS. 1A and 1B, the microelectronic package 10 caninclude packaging structure, for example, a dielectric element orsubstrate 20, e.g., a support element that includes or consistsessentially of dielectric material, e.g., organic or inorganicdielectric material such as, without limitation, oxides, nitrides, orcombinations thereof, epoxies, polyimides, thermoset materials orthermoplastics, or other polymeric materials, or composite materialssuch as epoxy-glass, which can be FR-4 or BT resin structures, or whichcan be a portion of a tape utilized in tape-automated bonding (“TAB”),for example. The dielectric element 20 has first and second oppositelyfacing surfaces 21 and 22.

In some cases, the dielectric element 20 can consist essentially of amaterial having a low coefficient of thermal expansion (“CTE”) in aplane of the substrate (in a direction parallel to the first surface 21of the substrate), i.e., a CTE of less than 12 parts per million perdegree Celsius (hereinafter, “ppm/° C.”), such as a semiconductormaterial e.g., silicon, or a dielectric material such as ceramicmaterial or silicon dioxide, e.g., glass. Alternatively, the substrate20 may include a sheet-like substrate that can consist essentially of apolymeric material such as polyimide, epoxy, thermoplastic, thermosetplastic, or other suitable polymeric material or that includes orconsists essentially of composite polymeric-inorganic material such as aglass reinforced structure of BT resin (bismaleimide triazine) orepoxy-glass, such as FR-4, among others. In one example, such asubstrate 20 can consist essentially of a material having a CTE of lessthan 30 ppm/° C. in the plane of the dielectric element, i.e., in adirection along its surface.

In FIGS. 1A and 1B, the directions parallel to the first surface 21 ofthe dielectric element 20 are referred to herein as “horizontal” or“lateral” directions, whereas the directions perpendicular to the firstsurface are referred to herein as upward or downward directions and arealso referred to herein as the “vertical” directions. The directionsreferred to herein are in the frame of reference of the structuresreferred to. Thus, these directions may lie at any orientation to thenormal “up” or “down” directions in a gravitational frame of reference.

A statement that one feature is disposed at a greater height “above asurface” than another feature means that the one feature is at a greaterdistance in the same orthogonal direction away from the surface than theother feature. Conversely, a statement that one feature is disposed at alesser height “above a surface” than another feature means that the onefeature is at a smaller distance in the same orthogonal direction awayfrom the surface than the other feature.

First, second, and third apertures 26 a, 26 b, and 26 c can extendbetween the first and second surfaces 21, 22 of the dielectric element20. As can be seen in FIG. 1A, the dielectric element 20 can have twothree apertures 26 a, 26 b, and 26 c extending therethrough. The longestdimensions of the apertures 26 a, 26 b, and 26 c can define first,second, and third parallel axes 29 a, 29 b, and 29 c (collectively axes29). The first and second parallel axes 29 a and 29 b can define acentral region 23 of the second surface 22 of the dielectric element 20located between the axes 29 a and 29 b. A first peripheral region 28 aof the second surface is disposed between axis 29 a and the peripheraledge 27 a of the dielectric element. A second peripheral region 28 b ofthe second surface is disposed between axis 29 b and a peripheral edge27 b of the dielectric element opposite from peripheral edge 27 a.Hereinafter, a statement that a terminal is disposed between an apertureof a substrate and a given feature of a substrate or package such as aperipheral edge thereof shall mean that the terminal is disposed betweenan axis of the aperture and the given feature.

The dielectric element 20 can have a plurality of terminals 25, e.g.,conductive pads, lands, or conductive posts at the second surface 22 ofthe dielectric element 20. As used in this disclosure with reference toa component, e.g., an interposer, microelectronic element, circuitpanel, substrate, etc., a statement that an electrically conductiveelement is “at” a surface of a component indicates that, when thecomponent is not assembled with any other element, the electricallyconductive element is available for contact with a theoretical pointmoving in a direction perpendicular to the surface of the componenttoward the surface of the component from outside the component. Thus, aterminal or other conductive element which is at a surface of asubstrate may project from such surface; may be flush with such surface;or may be recessed relative to such surface in a hole or depression inthe substrate.

The terminals 25 can be configured for connecting the microelectronicpackage 10 to at least one component external to the microelectronicpackage. The terminals 25 can function as endpoints for the connectionof the microelectronic package 10 with corresponding electricallyconductive elements of an external component such as the contacts of acircuit panel 60, e.g., printed wiring board, flexible circuit panel,socket, other microelectronic assembly or package, interposer, orpassive component assembly, among others. In one example, such a circuitpanel can be a motherboard or DIMM module board. In a particularexample, the circuit panel 60 can include an element having a CTE lessthan 30 ppm/° C. In one embodiment, such an element can consistessentially of semiconductor, glass, ceramic or liquid crystal polymermaterial.

In one example, terminals 25 a that are disposed in the central region23 of the second surface 22 of the dielectric element 20 can beconfigured to carry address signals. These terminals are referred toherein as “first terminals.” The first terminals 25 a comprise terminalsconfigured to carry address information. For example, when themicroelectronic elements 30 a, 30 b, 30 c include or are DRAMsemiconductor chips, each set 15 a, 15 b of first terminals 25 a can beconfigured to carry sufficient address information transferred to themicroelectronic package 10 that is usable by circuitry within thepackage, e.g., row address and column address decoders, and bankselection circuitry of one or more of the microelectronic elements 30 todetermine an addressable memory location from among all the availableaddressable memory locations of a memory storage array within amicroelectronic element in the package. In a particular embodiment, thefirst terminals 25 a can be configured to carry all the addressinformation used by such circuitry within the microelectronic package 10to determine an addressable memory location within such memory storagearray. In one example, the first terminals 25 a can be configured tocarry all of the address information usable by circuitry within themicroelectronic package 10.

In one example, the first terminals 25 a can be configured to carry eachof a group of signals of a command-address bus of the microelectronicelement; i.e., command signals, address signals, bank address signals,and clock signals that are transferred to the microelectronic package,wherein the command signals include write enable, row address strobe,and column address strobe signals, and the clock signals are clocks usedfor sampling the address signals. While the clock signals can be ofvarious types, in one embodiment, the clock signals carried by theseterminals can be one or more pairs of differential clock signalsreceived as differential or true and complement clock signals.

In a particular example in which the microelectronic elements 30 a, 30b, and 30 c include DDR3 type chips, the command signals transferred tothe microelectronic elements can include write enable (“WE”), rowaddress strobe (“RAS”), and column address strobe signals (“CAS”). Inone example in which the microelectronic elements 30 a, 30 b, and 30 cinclude DDR4 type chips, the command signals transferred to themicroelectronic elements can include write enable, row address strobe,column address strobe, activate (“ACT”), and parity (“PAR”) signals.Such contacts and/or terminals in packages containing DDR3 or DDR4 chipsthat are configured to receive the aforementioned command signals can beincluded in any of the embodiments described herein.

In a particular embodiment, the first set 15 a of first terminals 25 acan be configured to carry all the address information used by thecircuitry within the microelectronic package 10 to determine anaddressable memory location within the first and third microelectronicelements 30 a, 30 c and the second set 15 b of first terminals 25 a canbe configured to carry all the address information used by the circuitrywithin the microelectronic package 10 to determine an addressable memorylocation within the second microelectronic element 30 b. In one example,each set 15 a, 15 b of first terminals 125 a can be configured to carryeach of a group of signals of a command-address bus of the correspondingmicroelectronic elements; i.e., command signals, address signals, bankaddress signals, and clock signals that are transferred to themicroelectronic package 10. In some examples (e.g., FIGS. 1F and 1G),the first set 15 a of first terminals 25 a and the second set 15 b offirst terminals can each be configured to carry all of the same signals(e.g., having the same numerical weight).

In one example, as can also be seen in FIGS. 1F and 1G, the signalassignments of corresponding ones of the first terminals 25 a in thefirst and second sets 15 a, 15 b can be symmetric about a theoreticalfourth axis 29 d between the first and second sets, the fourth axisbeing parallel to the first, second, and third axes 29 a, 29 b, 29 c. Inone embodiment, such a fourth axis 29 d can be located within one ballpitch of the terminals of a centerline of the substrate 20 locatedequidistant between the first and second opposed edges 27 a, 27 b. Asshown in FIGS. 1B, 1F, and 1G, the first and second sets 15 a, 15 b ofthe first terminals 25 b can be disposed at positions within respectivefirst and second grids, and columns of the first terminals in the firstand second grids can extend in a direction D1 parallel to the first andsecond opposed edges 27 a, 27 b of the substrate 20.

As further seen in FIG. 1B, in addition to first terminals 25 a, secondterminals 25 b can be disposed at the second surface 22 of the substrate20. As can be seen in FIG. 1B, a first set 17 a of the second terminals25 b can be disposed in the first peripheral region 28 a of the secondsurface 22 of the substrate 20, a second set 17 b of the secondterminals 25 b can be disposed in the second peripheral region 28 b ofthe second surface of the substrate, and a third set 17 c of the secondterminals 25 b can be disposed in the central region 23 of the secondsurface of the substrate.

In one example, as can be seen in FIG. 1D, each of the memory arrays U0,U1, U2 of the microelectronic elements 30 a, 30 b, 30 c can have anindependent electrical connection 2 c, 2 d, 2 e to a correspondingfirst, second, or third set 17 a, 17 b, 17 c of second terminals 25 b,respectively. Stated another way, in the microelectronic package 10, thefirst, second, and third sets 17 a, 17 b, 17 c of second terminals 25 bare each connected to only one of the first, second, and thirdmicroelectronic elements 30 a, 30 b, 30 c, respectively.

In one embodiment, the first and second sets 17 a, 17 b of secondterminals 25 b can be electrically connected with the respective firstand second microelectronic elements 30 a, 30 b, and can be disposed inthe respective first and second peripheral regions 28 a, 28 b. In oneexample, the third set 17 c of the second terminals 25 b can beelectrically connected with the third microelectronic element 30 c, andthe third set of second terminals can include first and second groups 17d and 17 e disposed in the central region 23 of the second surface 22 ofthe substrate 20 on first and second opposite sides of the thirdaperture 26 c.

In one example, as can also be seen in FIGS. 1F and 1G, the signalassignments of corresponding ones of the second terminals 25 b in thefirst and second sets 17 a, 17 b can be symmetric about a theoreticalfourth axis 29 d between the first and second sets, the fourth axisbeing parallel to the first, second, and third axes 29 a, 29 b, 29 c. Inone embodiment, such a fourth axis 29 d can be located within one ballpitch of the terminals of a centerline of the substrate 20 locatedequidistant between the first and second opposed edges 27 a, 27 b. Asshown in FIGS. 1B, 1F, and 1G, the first and second sets 17 a, 17 b ofthe second terminals 25 b can be disposed at positions within respectivefirst and second grids, and columns of the second terminals in the firstand second grids extend in a direction D1 parallel to the first andsecond opposed edges 27 a, 27 b of the substrate 20.

Typically, the second terminals are configured to carry allbi-directional data signals for writing of data to and for reading ofdata from random access addressable locations of at least a main memorystorage array within each DRAM microelectronic element. However, in somecases, some of the second terminals can carry uni-directional datasignals for input to a microelectronic element for writing of data to amemory storage array, and some of the first terminals can carryuni-directional data signals output from a microelectronic element basedon data read from a memory storage array.

In one example, the second terminals 25 b can be configured to carry oneor more of data strobe signals, or other signals or reference potentialssuch as chip select, reset, power supply voltages, e.g., Vdd, Vddq, andground, e.g., Vss and Vssq. The second terminals 25 b may includeterminals assigned to carry data signals and also data masks and “on dietermination” (ODT) signals used to turn on or off parallel terminationsto termination resistors.

The microelectronic package 10 can include joining elements 11 attachedto the terminals 25 for connection with an external component. Thejoining elements 11 can be, for example, masses of a bond metal such assolder, tin, indium, a eutectic composition or combination thereof, oranother joining material such as an electrically conductive paste, anelectrically conductive adhesive or electrically conductive matrixmaterial or a combination of any or all of such bond metals orelectrically conductive materials. In a particular embodiment, thejoints between the terminals 25 and contacts of an external component(e.g., the circuit panel 60) can include an electrically conductivematrix material such as described in U.S. Pat. Nos. 8,890,304 and9,117,811, the disclosures of which are hereby incorporated herein byreference. In a particular embodiment, the joints can have a similarstructure or be formed in a manner as described therein.

The microelectronic package 10 can comprise a plurality ofmicroelectronic elements 30 (e.g., 30 a, 30 b, and 30 c) each having afront face 31 facing the first surface 21 of the dielectric element 20.Although the microelectronic elements 30 are shown in FIG. 1B as beingoffset from one another in a direction parallel to the axes 29, thatneed not be the case. Such an offset of the microelectronic elements 30is shown in the figures for improved clarity of the overlying locationof the microelectronic elements with respect to one another. In aparticular embodiment, peripheral edges 34 a of each of themicroelectronic elements 30 can lie in a first common plane, andperipheral edges 34 b opposite the peripheral edges 34 a of each of themicroelectronic elements can lie in a second common plane.

The front surfaces 31 of the first and second microelectronic elements30 a, 30 b can confront the first surface 21 of the substrate 20, andthe front surface of the third microelectronic element 30 c can at leastpartially overlie a rear surface 33 of at least one of the first andsecond microelectronic elements. In the example shown in FIG. 1A, thefront surface 31 of the third microelectronic element 30 c at leastpartially overlies the rear surface 33 of each of the first and secondmicroelectronic elements 30 a, 30 b. At least a portion of the centralregion 37 (FIG. 1E) of the front surface 31 of the third microelectronicelement 30 c can project beyond a lateral edge 32 of each of the firstand second microelectronic elements 30 a, 30 b. Accordingly, thecontacts 35 of the third microelectronic element 30 c can be positionedin a location projecting beyond the lateral edge 32 of each of the firstand second microelectronic elements 30 a, 30 b. In other examples (e.g.,FIG. 1H), the front surfaces 31 of all of the microelectronic elements30 a, 30 b, 30 c can be arranged in a single plane parallel to the firstsurface 21 of the substrate 20.

One or more adhesive layers can be positioned between the front surface31 of the first microelectronic element 30 a and the first surface 21 ofthe dielectric element 20, between the front surface of the secondmicroelectronic element 30 b and the first surface of the dielectricelement, and/or between the front surface of the third microelectronicelement 30 c and the rear surface 33 of one or both of the first andsecond microelectronic elements.

In one example, the microelectronic elements 30 can each comprise amemory storage element such as a dynamic random access memory (“DRAM”)storage array or that is configured to predominantly function as a DRAMstorage array (e.g., a DRAM integrated circuit chip). As used herein, a“memory storage element” refers to a multiplicity of memory cellsarranged in an array, together with circuitry usable to store andretrieve data therefrom, such as for transport of the data over anelectrical interface. In one example, each of the microelectronicelements 30 can have memory storage array function. In a particularembodiment, each microelectronic element 30 can embody a greater numberof active devices to provide memory storage array function than anyother function.

As further seen in FIG. 1E, each microelectronic element 30 can have aplurality of electrically conductive element contacts 35 exposed at thefront surface 31 thereof. The contacts 35 of each microelectronicelement 30 can be arranged in one (e.g., FIG. 1E) or in two or more(e.g., FIG. 1A) columns 36 disposed in a central region 37 of the frontface 31 that occupies a central portion of an area of the front face. Asused herein with respect to a face (e.g., a front face, a rear face) ofa microelectronic element, “central region” means an area, such asregion 37, occupying a middle third 41 c of a distance 38 betweenopposite peripheral edges 32 a, 32 b of the microelectronic element 30in a direction orthogonal to the edges 32 a, 32 b.

The central region 37 is disposed between peripheral regions 43 a, and43 b, each of which lies between the central region 37 and a respectiveperipheral edge 32 a or 32 b, and each peripheral region also occupyingan area covering a respective third 41 a or 41 b of the distance 38between the opposite peripheral edges 32 a, 32 b. In the particularexample shown in FIG. 1E, when the contacts 35 of each microelectronicelement 30 are arranged in a central region 37 of the microelectronicelement, the contacts can be arranged along an axis 39 that bisects themicroelectronic element. As shown in FIG. 1A, the contacts 35 of eachmicroelectronic element 30 can be aligned with at least one of theapertures 26. In one example, the contacts of microelectronic element 30a can be aligned only with one of the apertures 26 a, the contacts ofmicroelectronic element 30 b can be aligned only with another one of theapertures 26 b, and the contacts of microelectronic element 30 c can bealigned only with yet another one of the apertures 26 c.

The microelectronic elements 30 in a microelectronic package 10 can beconfigured in accordance with one of several different standards, e.g.,standards of JEDEC, which specify the type of signaling thatsemiconductor chips (such as the microelectronic elements 30) transmitand receive through the contacts 35 thereof.

Thus, in one example, each of the microelectronic elements 30 can be ofDDRx type, i.e., configured in accordance with one of the JEDEC doubledata rate DRAM standards DDR3, DDR4, or one or more of their follow-onstandards (collectively, “DDRx”). Each DDRx type microelectronic elementcan be configured to sample the command and address information coupledto the contacts thereof at a first sampling rate, such as once per clockcycle (e.g., on the rising edge of the clock cycle). In particularexamples, the DDRx type microelectronic elements can have four, eight orsixteen contacts used for transmitting and receiving bi-directional datasignals, each such bi-directional signal referred to as a “DQ” signal.Alternatively, the first terminals of a package can be configured tocarry uni-directional data signals such as data signals or “D” signalsinput to the package and data signals “Q” output from the package, orcan be configured to carry a combination of bi-directional anduni-directional data signals.

In another example, each of the microelectronic elements 30 can be ofLPDDRx type, i.e., configured in accordance with one of the JEDEC lowpower double data rate DRAM standards LPDDR3 or one or more of itsfollow-on standards (collectively, “LPDDRx”). LPDDRx type DRAM chips areavailable which have 32 contacts assigned to carry DQ signals. There areother differences as well. Each contact 35 on an LPDDRx type DRAM chipmay be used to simultaneously carry two different signals in interleavedfashion. For example, each contact 35 on such DRAM chip can be assignedto carry one signal which is sampled on the rising edge of the clockcycle and can also be assigned to carry another signal that is sampledon the falling edge of the clock cycle.

Thus, in LPDDRx type chips, each microelectronic element 30 a, 30 b, 30c can be configured to sample the command and address information inputto the contacts thereof at a second sampling rate, such as twice perclock cycle (e.g., on both the rising edge and on the falling edge ofthe clock cycle). Accordingly, the number of contacts on the LPDDRx DRAMchip that carry address information or command-address bus informationcan also be reduced. In a particular example of LPDDRx type chips, oneor more of the contacts 35 of each microelectronic element 30 a, 30 b,30 c can be configured to carry address information at one edge of theclock cycle and command information at another edge of the clock cycle,such that a single contact can be used to alternatingly receive commandand address information. Such contacts and/or terminals that areconfigured to alternatingly receive command and address information canbe included in any of the embodiments described herein.

Electrical connections between the contacts 35 and the terminals 25 caninclude leads, e.g., wire bonds 40, or other possible structure in whichat least portions of the leads are aligned with at least one of theapertures 26. For example, as seen in FIG. 1A, at least some of theelectrical connections can include a wire bond 40 that extends beyond anedge of an aperture 26 in the dielectric element 20, and is joined atone end to the contact 35 of a microelectronic element and to aconductive element 24 of the dielectric element 20 at another end. Inone example, at least some of the leads can include wire bonds 40extending through at least one of the apertures 26 a, 26 b, 26 c. In oneembodiment, at least some of the electrical connections between thedielectric element and the contacts of the microelectronic element canbe through lead bonds, i.e., leads that are integral with otherconductive elements on the dielectric element and which extend in alateral direction along one or both of the first and second surfaces 21,22 of the dielectric element 20 and are bonded to contacts of one ormore of the microelectronic elements, each lead having a portion alignedwith at least one of the apertures 26.

The microelectronic package 10 can also include an encapsulant 50 thatcan optionally cover, partially cover, or leave uncovered the rearsurfaces 33 of the microelectronic elements 30. For example, in themicroelectronic package 10 shown in FIG. 1A, an encapsulant can beflowed, stenciled, screened or dispensed onto the rear surfaces 33 ofthe microelectronic elements 30. The microelectronic package 10 canfurther include an encapsulant 51 that can optionally cover the wirebonds 40 and the conductive elements 24 of the dielectric element 20.Such an encapsulant can also optionally extend into the apertures 26,and it can cover the contacts 35 of the microelectronic elements 30.

In the embodiment of FIGS. 1A and 1B, at least some signals that passthrough at least some of the first terminals 25 a of the package can becommon to at least two of the microelectronic elements 30, while othersignals that pass through at least some of the first terminals of thepackage may only be electrically connected with one of themicroelectronic elements. These signals can be routed throughconnections such as conductive traces extending on or within thedielectric element 20 in directions parallel to the first and secondsurfaces 21, 22 of the dielectric element from the terminals 25 to thecorresponding contacts 35 of the microelectronic elements 30.

For example, a first terminal 25 a in a first set 15 a of the firstterminals disposed in the central region 23 of the second surface 22 ofthe dielectric element 20 can be electrically coupled with a conductivecontact 35 of each of the first and third microelectronic elements 30 aand 30 c through conductive traces, conductive elements 24, e.g., bondpads, and wire bonds 40 joined to corresponding ones of the conductiveelements and the contacts. A first terminal 25 a in a second set 15 b ofthe first terminals disposed in the central region 23 of the secondsurface 22 of the dielectric element 20 can be electrically coupled witha conductive contact 35 of only the second microelectronic element 30 bthrough conductive traces, a conductive element 24, e.g., a bond pad,and a wire bond 40 joined to corresponding ones of the conductiveelements and the contacts.

In one example, the first group 15 a of first terminals 25 a disposed ona first side of a theoretical axis 29 d can have signal assignments thatare symmetric about the axis 29 d with the signal assignments of thesecond group 15 b of first terminals that are disposed on a second sideof the axis 29 d. The theoretical axis 29 d can extend parallel to thelongitudinal axis 29 of each of the apertures 26 and is disposed betweenthe proximate edges of the respective apertures. In the example shown inFIG. 1B, the theoretical axis 29 d can be coincident with the third axis29 c, although that need not always be the case. In each of the examplesshown in FIGS. 1F and 1G, the first group 15 a of first terminals 25 adisposed on a first side of the theoretical axis 29 d has signalassignments that are symmetric about the axis 29 d with the signalassignments of the second group 15 b of first terminals that aredisposed on a second side of the axis 29 d. In particular embodiments(not shown), the first group 15 a of first terminals 25 a may havesignal assignments that are not symmetric about a theoretical axis withthe signal assignments of the second group 15 b of first terminals.

Typically, the theoretical axis 29 d is disposed at or near the mediandistance between the proximate edges of the first and second apertures26 a, 26 b. “Symmetric” as used herein in connection with signalassignments of terminals for carrying address information means that thesignal assignment of a terminal on a first side of the theoretical axishas a name and numerical weight which are the same as that of anotherterminal on an opposite side of the axis at a position symmetric aboutthe axis from the terminal on the first side. The “numerical weight” ofthe address information assigned to a given terminal refers to the placeof that address information within the places of an address that isspecified by the address information. For example, an address can bespecified by 20 address bits A0 . . . A19. Each bit has a numericalweight, from the highest-ordered address information bit A19, which hasa numerical weight of 19 representing 2̂19 (2 to the power of 19), to thelowest-ordered address information bit A0, which has a numerical weightof zero representing 2̂0 (2 to the power of zero), which is the l's placeof the address.

In a particular embodiment, the first and second groups 15 a, 15 b offirst terminals 25 a of the microelectronic package 10 can be configuredto have modulo-X symmetry about the theoretical axis 29 d.Microelectronic packages having groups of address and/or data terminalshaving modulo-X symmetry are shown and described in U.S. Pat. Nos.8,441,111 and 9,123,555, which are hereby incorporated by referenceherein in their entireties.

As can be seen in FIG. 1C, such an example can have two independent setsof electrical connections between the microelectronic package 10 and asignal bus (e.g., the address bus or command/address bus 3 on thecircuit panel 60 in FIG. 2). As shown in FIG. 1C, two of the memoryarrays U0, U1 of the microelectronic elements 30 a, 30 c, respectively,can have a shared electrical connection 2 a to a first set 15 a of firstterminals 25 a on the second surface 22 of the substrate 20, while athird memory array U2 of the microelectronic element 30 b can have anindependent electrical connection 2 b to a second set 15 b of the firstterminals on the second surface of the substrate.

Stated another way, in the microelectronic package 10, the first set 15a of the first terminals 25 a are electrically connected with the firstand third microelectronic elements 30 a, 30 c and not electricallyconnected with the second microelectronic element 30 b, and the secondset 15 b of the first terminals are electrically connected with thesecond microelectronic element and not electrically connected with thefirst or third microelectronic elements. In this way, the first andthird microelectronic elements 30 a, 30 c share an electrical connection2 a to the first set 15 a of the first terminals 25 a, and the secondmicroelectronic element 30 b has an unshared independent electricalconnection 2 b to a second set 15 b of the first terminals.

In one potential example of the terminal configuration of themicroelectronic package 10 described above, FIG. 1F shows amicroelectronic package 110 having a ball map that can apply to themicroelectronic package 10 depicted in FIGS. 1A and 1B. Themicroelectronic package 110 has an exemplary ballout map of terminals 25on the second surface 22 of the substrate 20, wherein terminals A0-A16are address terminals that can be first terminals 25 a. The firstterminals 25 a can include first and second sets 15 a, 15 b that caneach have an independent electrical connection to an address bus orcommand/address bus of a circuit panel such as the circuit panel 60. Theterminals DQ0-DQ7 are data terminals that can be second terminals 25 b.The second terminals 25 b can include first, second, and third sets 17a, 17 b, 17 c that can each have an independent electrical connection toa data bus of a circuit panel such as the circuit panel 60. Otherterminals 25 on the ballout map can be as shown in FIG. 1F. In oneexample, the microelectronic elements 30 in the microelectronic package110 can be configured in accordance with one of the JEDEC double datarate DRAM standard DDR4.

In another potential example of the terminal configuration of themicroelectronic package 10 described above, FIG. 1G shows amicroelectronic package 210 having a ball map that can apply to themicroelectronic package 10 depicted in FIGS. 1A and 1B. Themicroelectronic package 210 has an exemplary ballout map of terminals 25on the second surface 22 of the substrate 20, wherein terminals A0-A16are address terminals that can be first terminals 25 a. The firstterminals 25 a can include first and second sets 15 a, 15 b that caneach have an independent electrical connection to an address bus orcommand/address bus of a circuit panel such as the circuit panel 60.Terminals DQ0-DQ3 are data terminals that can be second terminals 25 b.The second terminals 25 b can include first, second, and third sets 17a, 17 b, 17 c that can each have an independent electrical connection toa data bus of a circuit panel such as the circuit panel 60. Otherterminals 25 on the ballout map can be as shown in FIG. 1G. In oneexample, the microelectronic elements 30 in the microelectronic package210 can be configured in accordance with one of the JEDEC double datarate DRAM standard DDR4.

FIG. 1H shows a microelectronic package 310 that is a variation of theembodiment of FIGS. 1A and 1B. Each feature or element of themicroelectronic package 310 can be the same as a corresponding featureor element of the microelectronic package 10, except as otherwisedescribed below. In FIG. 1H, the microelectronic elements 30 a, 30 b, 30c can be disposed adjacent to one another, with the front faces 31facing toward the first surface 21 of the substrate 20 and arranged in asingle plane P parallel to the first surface of the substrate. In thisvariation, similar to the embodiment of FIGS. 1A and 1B, each of themicroelectronic elements 30 can be electrically connected to substratecontacts 24 by leads (e.g., wire bonds 40) aligned with apertures 26 a,26 b, 26 c extending through the substrate 20.

Although the microelectronic elements 30 are shown in FIGS. 1A and 1H asbeing wire bonded to contacts of the substrate with their front facesfacing the first surface of the package substrate, that need not be thecase. For example, in other embodiments, a variation of themicroelectronic package 10 can have microelectronic elements eachbearing element contacts at a front face thereof, the front faces facingaway from the first surface of the substrate. The microelectronicelements can each be electrically connected with conductive elements ofthe substrate by electrically conductive structure such as wire bondsextending above the front face between the element contacts andsubstrate contacts at the first surface of the substrate. The substratecontacts can be electrically connected with the terminals at the secondsurface of the substrate. In some variations, the front faces of themicroelectronic elements can be arranged in a single plane parallel tothe first surface of the substrate, or alternatively, themicroelectronic elements can be arranged in a vertical stack above thefirst surface of the substrate.

In another embodiment, a variation of the microelectronic package 10 canhave microelectronic elements each bearing element contacts a front facethereof, the front faces facing toward the first surface of thesubstrate, with the element contacts facing and joined to substratecontacts at the first surface of the substrate by conductive joiningmaterial extending therebetween. The substrate contacts can beelectrically connected with the terminals at the second surface of thesubstrate.

In yet another variation of the of the microelectronic package 10, thesubstrate can be omitted, such that the microelectronic package 10 canbe in form of microelectronic elements 30 having packaging structurethat includes an electrically conductive redistribution layer overlyingthe front face 31 of one or more of the microelectronic elements. Theredistribution layer has electrically conductive metallized viasextending through a dielectric layer of the package to the elementcontacts 35 of the microelectronic elements 30. The redistribution layermay include the terminals 25 and traces electrically connected with theterminals, such that the terminals are electrically connected with theelement contacts, such as through the metallized vias or throughmetallized vias and electrically conductive traces. In this case, thepackage can be referred to as a “wafer-level package having aredistribution layer thereon.” In an additional variation, such amicroelectronic package having a redistribution layer thereon asdescribed above can have one or more columns of the terminals 25disposed on areas of the dielectric layer that extend laterally beyondone or more edges of the microelectronic elements. In this case, thepackage can be referred to as a “fan-out wafer-level package having aredistribution layer thereon.”

Referring to FIG. 2, in accordance with an aspect of the invention, amicroelectronic assembly 1 can include first, second, third, fourth,fifth, and sixth microelectronic packages 10 a, 10 b, 10 c, 10 d, 10 e,and 10 f (collectively, the microelectronic packages 10) assembled witha circuit panel 60 in a clamshell arrangement, with the first, third,and fifth microelectronic elements mounted to the first surface 61 ofthe circuit panel, and with the second, fourth, and sixthmicroelectronic elements mounted to the second surface 62 of the circuitpanel. Specifically, as seen in FIG. 2, the packages 10 a, 10 b can bemounted opposite one another to respective panel contacts at the firstand second surfaces 61, 62 of the circuit panel 60, such that the firstpackage 10 a occupies the same or substantially the same area of thecircuit panel as the second package 10 b.

Each of the microelectronic packages 10 of the microelectronic assembly1 can have a similar structure that includes first, second, and thirdmicroelectronic elements 30 as described above with reference to FIGS.1A and 1B. As can be seen in FIG. 2, each of the memory arrays U0through U17 of the microelectronic elements 30 within themicroelectronic packages 10 can be electrically connected to aconnection region 70 of an address bus or command/address bus 3 on thecircuit panel 60, via a shared electrical connection 2 a or anindependent electrical connection 2 b. In the examples herein, eachmemory array U0 through U17 is located within a correspondingmicroelectronic element 30.

In the examples of FIGS. 2-4, the first, second, and thirdmicroelectronic elements 30 a, 30 b, and 30 c of the firstmicroelectronic package 10 a contain memory arrays U0, U1, and U2,respectively, and the first, second, and third microelectronic elementsof the second microelectronic package 10 b contain memory arrays U3-U5,respectively. In similar fashion, the first, second, and thirdmicroelectronic elements 30 a, 30 b, and 30 c of the thirdmicroelectronic package 10 c contain memory arrays U6-U8, respectively,the first, second, and third microelectronic elements of the fourthmicroelectronic package 10 d contain memory arrays U9-U11, respectively,the first, second, and third microelectronic elements of the fifthmicroelectronic package 10 e contain memory arrays U12-U14,respectively, and the first, second, and third microelectronic elementsof the sixth microelectronic package 10 f contain memory arrays U15-U17,respectively.

The microelectronic assembly 1 can include an address bus orcommand-address bus 3 that can comprise a plurality of signal conductorseach passing sequentially through connection regions 70 of the circuitpanel 60 such as first, second, third, fourth, fifth, and sixthconnection regions 71, 72, 73, 74, 75, and 76. The bus 3 can extendwithin or on a support, which may be a portion of the circuit panel 60.The bus 3 can comprise a plurality of signal conductors for transmittingaddress signals or address and command signals. The circuit panel 60 canhave conductive panel contacts 65 at a surface of the support, such asthe first panel contacts 65 a at the first surface 61 of the circuitpanel and the second panel contacts 65 b at the second surface 62 of thecircuit panel. The microelectronic packages 10 can be mounted to thepanel contacts 65, for example, by joining elements 11 that can extendbetween the terminals 25 and the panel contacts.

The address bus or command-address bus 3 can comprise a plurality ofsignal conductors electrically connected with a plurality of mutuallyexclusive connection regions 71-76. As used herein, “mutually exclusive”connection regions are not electrically connected to one another withinthe circuit panel 60. In the example shown in FIG. 2, each connectionregion 70 can include first panel contacts 65 a disposed at the firstsurface 61 and second panel contacts 65 b disposed at the second surface62, and the first and second panel contacts in a particular connectionregion can be electrically coupled with one another. Thus, at least somefirst terminals 25 a of both a first microelectronic package 10 a and asecond microelectronic package 10 b can be electrically coupled with oneanother through a particular connection region (e.g., the firstconnection region 71).

In one example, the address bus 3 can be configured to carry all addresssignals usable by circuitry within the microelectronic packages 30. In aparticular example (e.g., DDR3 chips), the address bus 3 can beconfigured to carry all command signals transferred to each of themicroelectronic packages 30, the command signals being write enable, rowaddress strobe, and column address strobe signals. In one embodiment(e.g., DDR4 chips), all of the command signals transferred to each ofthe microelectronic packages 30 can be write enable, row address strobe,column address strobe, activate, and parity signals. The first terminals25 a of each of the microelectronic packages 30 can be configured tocarry all of the address signals usable by circuitry within therespective microelectronic package.

On the circuit panel 60, e.g., a printed circuit board, module card,etc., these above-noted signals of the command-address bus: i.e.,command signals, address signals, bank address signals, and clocksignals, can be bussed to multiple microelectronic packages 10 that areconnected thereto in parallel, for example, to first and secondmicroelectronic packages 10 a, 10 b mounted to opposite surfaces of thecircuit panel in a clamshell configuration.

In one embodiment, the first terminals 25 a of the respectivemicroelectronic packages 10 can be functionally and mechanicallymatched, such that each microelectronic package can have the samepattern of first terminals at the second surface 22 of the substrate 20of the respective microelectronic package with the same function,although the particular dimensions of the length, width, and height ofeach microelectronic package can be different than that of the othermicroelectronic packages.

In one example, each of the sets or groups 15 a and 15 b of the firstterminals 25 a of each microelectronic package 30 can be configured tocarry all of the same address signals. As can be seen in FIG. 2, in aparticular embodiment, each of the sets or groups 15 a and 15 b of thefirst terminals 25 a of each microelectronic package 30 can be disposedin respective first and second opposite sides of a theoretical axis 29 dextending along the second surface 22 of the respective substrate 20. Inone example, the first terminals 25 a of the first and secondmicroelectronic packages 10 a, 10 b can be arranged at positions offirst and second grids, and the first and second grids can be alignedwith one another in x and y orthogonal directions parallel to the firstand second surfaces 61, 62 of the circuit panel 60, the alignment beingwithin a distance equal to a minimum pitch P1 (FIG. 1A) between adjacentterminals of the grids.

As can be seen in FIG. 2, each of the connection regions 71-76 of theaddress bus 3 is electrically connected with three corresponding ones ofthe microelectronic elements 30 containing three corresponding ones ofthe memory arrays U0-U17. Also in this example, each microelectronicelement 30 in the microelectronic assembly 1 may be electrically coupledto the address bus 3 via only one of the connection regions 71-76.Therefore, although both of the first and second microelectronicpackages 10 a and 10 b are electrically connected with both the firstand second connection regions 71, 72, each of the first and secondconnection regions is electrically connected with only one of the sets15 of the first terminals 25 a of each of the first and secondmicroelectronic packages.

For example, as shown in FIG. 2, the first connection region 71 iselectrically connected only with memory arrays U0 and U1 of the firstmicroelectronic package 10 a (via the first set 15 a of the firstterminals 25 a) and with memory array U5 of the second microelectronicpackage 10 b (via the second set 15 b of the first terminals).Therefore, the first connection region 71 is electrically connected onlywith the first and third microelectronic elements 30 a, 30 c of thefirst microelectronic package 10 a and with the second microelectronicelement 30 b of the second microelectronic package 10 b.

Likewise, the second connection region 72 is electrically connected onlywith memory array U2 of the first microelectronic package 10 a (via thesecond set 15 b of the first terminals 25 a) and with memory arrays U3and U4 of the second microelectronic package 10 b (via the first set 15a of the first terminals). Therefore, the second connection region 72 iselectrically connected only with the second microelectronic element 30 bof the first microelectronic package 10 a and with the first and thirdmicroelectronic elements 30 a, 30 c of the second microelectronicpackage 10 b.

Stated another way, the first and third microelectronic elements 30 a,30 c of the first microelectronic package 10 a and the secondmicroelectronic element 30 b of the second microelectronic package 10 bcan be electrically coupled to the address bus 3 only at a first one ofthe connection regions 71, and the second microelectronic element 30 bof the first microelectronic package 10 a and the first and thirdmicroelectronic elements 30 a, 30 c of the second microelectronicpackage 10 b are electrically coupled to the address bus only at asecond one of the connection regions 72. In one example, the first andthird microelectronic elements 30 a, 30 c of the third microelectronicpackage 10 c and the second microelectronic element 30 b of the fourthmicroelectronic package 10 d can be electrically coupled to the addressbus 3 only at a third one of the connection regions 73, and the secondmicroelectronic element 30 b of the third microelectronic package 10 cand the first and third microelectronic elements 30 a, 30 c of thefourth microelectronic package 10 d are electrically coupled to theaddress bus only at a fourth one of the connection regions 74.

In some examples, the microelectronic assembly 1 can further include anoptional controller package 4 electrically coupled to the address bus orcommand-address bus 3. The controller package 4 can include a controllerelement configured to control generation of address signals fortransmission on the bus 3. In one example, first and secondmicroelectronic packages 10 a, 10 b can overlie respective first andsecond areas of a same surface of the support or circuit panel 60, andthe controller package 4 can overlie a third area of the circuit panel.Such a controller package 4 may be included in embodiments of themicroelectronic assembly 1 where the assembly is a registered DIMM. Inother embodiments, the microelectronic assembly may not include thecontroller package 4 where the assembly is a DIMM without registers,e.g., UDIMM (unregistered DIMM).

As illustrated in FIG. 2, signals transported by the address bus orcommand-address bus 3 can be routed in at least one direction D3 betweenconnection sites on a circuit panel such as the circuit panel 60 atwhich a plurality of microelectronic packages 10 are connected, suchthat signals of the bus reach each connection region 70 at differenttimes.

The at least one direction D3 can be transverse or orthogonal to adirection D2 (FIG. 1E) in which at least one column 36 of a plurality ofcontacts 35 on at least one microelectronic element 30 extends. In sucha way, the signal conductors of the command-address bus 3 on (i.e., onor within) the circuit panel 60 can in some cases be spaced apart fromone another in the direction D2 that is parallel to the at least onecolumn 36 of contacts 35 on a microelectronic element 30 within amicroelectronic package 10 connected to, or to be connected to thecircuit panel 60.

In the embodiment shown in FIG. 2, the microelectronic packages 10 a and10 c can be first and third microelectronic packages each joined to thepanel contacts 65 a at respective first and second different areas 60 a,60 b of the first surface 61 of the circuit panel 60. The firstmicroelectronic package 10 a can include first, second, and thirdmicroelectronic elements 30 a, 30 b, 30 c having memory arrays U0, U1,and U2, and the third microelectronic package 10 c can include first,second, and third microelectronic elements 30 a, 30 b, 30 c havingmemory arrays U6, U7, and U8.

The first terminals 25 a of the microelectronic packages 10 a and 10 ccan be electrically coupled to first, second, third, and fourth sets 66,67, 68, and 69 of the first panel contacts 65 a. In turn, the first,second, third, and fourth sets 66, 67, 68, and 69 of the first panelcontacts 65 a can be electrically coupled to the signal conductors ofthe bus 3. In one example (e.g., DDR3 chips), each of the first, second,third, and fourth sets 66, 67, 68, and 69 of first panel contacts 65 acan be configured to carry address information usable by circuitrywithin the microelectronic packages 10 and command signals transferredto the microelectronic packages, the command signals being write enable,row address strobe, and column address strobe signals. In one embodiment(e.g., DDR4 chips), the command signals transferred to themicroelectronic packages can be write enable, row address strobe, columnaddress strobe, activate, and parity signals.

Each of the memory arrays U0, U1, U2, U6, U7, and U8 of themicroelectronic packages 10 a, 10 c can be electrically coupled to thesignal conductors of the bus 3 at one of the connection regions 71, 72,73, 74 via a set 66, 67, 68, 69 of the first panel contacts 65 a and viapackaging structure (e.g., first terminals 25 a) of the respectivemicroelectronic package for receiving address signals or address andcommand signals.

In the embodiment shown in FIG. 2, each of the memory arrays U0, U1, U2,U6, U7, and U8 of the microelectronic packages 10 a, 10 c can beelectrically coupled to the bus 3 at only one of the first, second,third, and fourth connection regions 71, 72, 73, 74. In a particularexample, a memory array U0 of a first microelectronic package 10 a canhave address inputs coupled only to the first set 66 of first panelcontacts 65 a, and a memory array U2 of the first microelectronicpackage 10 a can have address inputs coupled only to the second set 67of first panel contacts 65 a.

In the example shown in FIG. 2, geometric centers G1, G2, and G3 of therespective first, second, and third sets 66, 67, 68 of the first panelcontacts 65 a have first, second, and third substantially equal relativeseparation distances S1, S2, and S3 from the geometric centers G2, G3,and G4 of the second, third, and fourth sets 66, 67, 68 of the panelcontacts, respectively. In one example, any difference among the first,second, and third substantially equal relative separation distances S1,S2, and S3 can fall within a same tolerance, for example, a sametolerance of ±0.5 mm, or in a particular embodiment, a same tolerance of±1% of any one of the separation distances.

In one embodiment, the geometric centers G1, G2, G3, and G4 of therespective first, second, third, and fourth sets 66, 67, 68, 69 of thefirst panel contacts 65 a can be equally spaced from one another along acommon theoretical axis A1 extending parallel to the first surface 61 ofthe circuit panel 60. As used herein, a statement that elements are“equally spaced” with respect one another along a common theoreticalaxis means that the actual difference in spacing between adjacent onesof the elements is within a typical manufacturing tolerance known to oneskilled in the relevant art.

In the embodiment of FIG. 2, an electrical characteristic between thefirst and second connection regions 71, 72 can be within a sametolerance of the electrical characteristic between the second and thirdconnection regions 72, 73. The electrical characteristic can be, forexample, an electrical trace length, an electrical propagation delay, acharacteristic impedance of the signal conductors, or a difference inelectrical load applied to the address bus from the microelectronicelement connected with the respective connection region.

In one embodiment, each of the first, second, and third connectionregions 71, 72, 73 can have respective first, second, and third relativeelectrical lengths (i.e., electrical trace lengths) from the respectivesecond, third, and fourth connection regions 72, 73, 74, and anydifference among the first, second, and third relative electricallengths can fall within a same tolerance, for example, a same toleranceof ±0.5 mm, or in a particular embodiment, a same tolerance of ±1% ofany one of the relative electrical lengths. In a particular embodiment,an electrical trace length between the first and second connectionregions 71, 72 can be within a same tolerance of the electrical tracelength between the second and third connection regions 72, 73.

In a particular embodiment, each of the second, third, and fourthconnection regions 72, 73, and 74 can be configured to receive addresssignals from the bus 3 at respective first, second, and third relativedelays (i.e., electrical propagation delays) from the respective first,second, and third connection regions 71, 72, and 73, and any differenceamong the first, second, and third relative delays can fall within asame tolerance, for example, a same tolerance of ±1% of any one of therelative delays. In a particular embodiment, an electrical propagationdelay between the first and second connection regions 71, 72 can bewithin a same tolerance of the electrical propagation delay between thesecond and third connection regions 72, 73.

In one example, a characteristic impedance of the signal conductors ofthe bus 3 between the first and second connection regions 71 and 72, andthe characteristic impedance of the signal conductors between the secondand third connection regions 72 and 73 can fall within a same tolerance,for example, a same tolerance of ±5 ohms. Likewise, a characteristicimpedance of the signal conductors of the bus 3 between the first andsecond connection regions 71 and 72, the characteristic impedance of thesignal conductors of the bus 3 between the second and third connectionregions 72 and 73, and the characteristic impedance of the signalconductors between the third and fourth connection regions 73 and 74 canfall within a same tolerance, for example, a same tolerance of ±5 ohms.

In one example, each of the groups of microelectronic elements 30electrically connected to a particular one of the connection regions71-76 can be configured to apply substantially a same load (i.e.,electrical load) to the bus 3 as any other of the groups ofmicroelectronic elements 30 electrically connected to another one of theconnection regions 71-76, for example, within a tolerance of ±5 ohms. Ina particular embodiment, a difference in electrical load applied to theaddress bus 3 via the first and second connection regions 71, 72 can bewithin a same tolerance of the difference in electrical load applied tothe address bus via the second and third connection regions 72, 73. Forexample, the same tolerance of the difference in electrical load appliedto the address bus can be within a tolerance of ±5 ohms.

FIG. 3 illustrates a microelectronic assembly 401 that is a variation ofthe microelectronic assembly 1 of FIG. 2. Each feature or element of themicroelectronic assembly 401 can be the same as a corresponding featureor element of the microelectronic assembly 1, except as otherwisedescribed below. As can be seen in FIG. 3, each of the connectionregions 471-479 (collectively 470) of the address bus 403 iselectrically connected with two corresponding ones of themicroelectronic elements 30 containing two corresponding ones of thememory arrays U0-U17. Also in this example, each microelectronic element30 in the microelectronic assembly 401 may be electrically coupled tothe address bus 3 via only one of the connection regions 471-479.Therefore, although both of the first and second microelectronicpackages 10 a and 10 b are electrically connected with two of theconnection regions 470, each of the connection regions is electricallyconnected with only two of the memory arrays U0-U17.

In the example of FIG. 3, the microelectronic packages 10 are in astaggered clamshell configuration. For example, the packages 10 a, 10 bcan be mounted opposite one another to respective panel contacts at thefirst and second surfaces 61, 62 of the circuit panel 60, but the firstpackage 10 a only occupies a portion of the same area of the circuitpanel as the second package 10 b, and another portion of the firstpackage does not occupy the same area as the second package.

Since each connection region is electrically connected with only two ofthe memory arrays U0-U17, the first set 15 a of the first terminals 25 aof each microelectronic package 10, through which the first and thirdmicroelectronic elements 30 a, 30 c have a shared electrical connection2 a to the address bus or command/address bus 3, does not share aconnection region 470 with any other microelectronic package. However,the second set 15 b of the first terminals 25 a of each microelectronicpackage 10, through which the second microelectronic element 30 b has anindependent electrical connection 2 b to the address bus orcommand/address bus 3, shares its connection region with a correspondingsecond set of first terminals of another microelectronic package mountedto the opposite side of the circuit panel 60.

Therefore, in the example shown in FIG. 3, the odd connection regions471, 473, 475, 477, and 479 are only connected with a first set 15 a offirst terminals 25 a of a single corresponding microelectronic package10, while even connection regions 472, 474, 476, and 479 are connectedwith a second set 15 b of first terminals of two microelectronicpackages 10 at opposite sides of the circuit panel. Similar to theexample of FIG. 2, each microelectronic element 30 (and each memoryarray U0-U17) of the microelectronic assembly 401 is electricallycoupled to the address bus 3 via only one of the connection regions 470.

More specifically, in the microelectronic assembly 401, the first andthird microelectronic elements 30 a, 30 c of the first microelectronicpackage 10 a are electrically coupled to the address bus 3 only at afirst one of the connection regions 471, the second microelectronicelement 30 b of the first microelectronic package and the secondmicroelectronic element of the second microelectronic package 10 b areelectrically coupled to the address bus only at a second one of theconnection regions 472, and the first and third microelectronic elementsof the second microelectronic package are electrically coupled to theaddress bus only at a third one of the connection regions 473. Thispattern is repeated for the third through sixth microelectronic packages10 c-10 f.

In the embodiment of FIGS. 2 and 3, when each microelectronic element 30is configured to carry 4 bi-directional data signals DQ0 . . . DQ3(e.g., FIG. 1G), the microelectronic assemblies 1 or 401 can each beconfigured to transmit 72 bi-directional data signals in tandem tosupport 72-bit single-rank memory access, including 8 bits for errorcorrection. Alternatively, the embodiments of FIGS. 2 and 3 could beexpanded to include 12 microelectronic packages containing 36microelectronic elements total, each microelectronic element configuredto carry 4 bi-directional data signals. In such embodiments, themicroelectronic assemblies 1 or 401 can each be configured to transmit72 bi-directional data signals in tandem to support 72-bit dual-rankmemory access, including 8 bits for error correction per rank. When eachmicroelectronic element 30 is configured to carry 8 bi-directional datasignals DQ0 . . . DQ7 (e.g., FIG. 1F), the microelectronic assemblies 1or 401 can each be configured to transmit 72 bi-directional data signalsin tandem to support 72-bit dual-rank memory access, including 8 bitsfor error correction per rank.

FIG. 4 illustrates a microelectronic assembly 401 a that is a variationof the microelectronic assembly 401 of FIG. 3. Each feature or elementof the microelectronic assembly 401 a can be the same as a correspondingfeature or element of the microelectronic assembly 401, except asotherwise described below. The microelectronic assembly 401 a is thesame as the microelectronic assembly 401, except that the ninthconnection region 479 is omitted, leaving eight connection regions471-478 on the address bus 3. This reduction of connection regions canbe accomplished by using no-connect panel contacts as the second panelcontacts 65 b that are electrically connected with the first set 15 a offirst terminals 25 a, which are electrically connected with the memoryarrays U16 and U15. As used herein, a “no-connect” panel contacts notconnected in any electrical path to the address bus within themicroelectronic assembly. By removing the electrical connections betweenthe address bus 3 and two of the eighteen microelectronic elements 30within the microelectronic assembly 401 a, that can remove theerror-correction feature of the microelectronic assembly 401 a.

In the embodiment of FIG. 4, when each microelectronic element 30 isconfigured to carry 4 bi-directional data signals DQ0 . . . DQ3 (e.g.,FIG. 1G), the microelectronic assembly 401 a can be configured totransmit 64 bi-directional data signals in tandem to support 64-bitsingle-rank memory access, without error correction. Alternatively, theembodiment of FIG. 4 could be expanded to include 11 or 12microelectronic packages 10 containing 33 or 36 microelectronic elementstotal, each microelectronic element configured to carry 4 bi-directionaldata signals. In such embodiments, if only 32 of the microelectronicelements are electrically connected to the address bus, themicroelectronic assembly 401 a can be configured to transmit 64bi-directional data signals in tandem to support 64-bit dual-rank memoryaccess, without error correction. When each microelectronic element 30is configured to carry 8 bi-directional data signals DQ0 . . . DQ7(e.g., FIG. 1F), the microelectronic assembly 401 a can each beconfigured to transmit 64 bi-directional data signals in tandem tosupport 64-bit dual-rank memory access, without error correction.

In the example of FIG. 4, the electrical connections between themicroelectronic packages 10 and the address bus 3 are the same as withthe microelectronic assembly 401, except for the sixth microelectronicpackage 10 f. In this example, the first and third microelectronicelements 30 a, 30 c of the fifth microelectronic package 10 e areelectrically coupled to the address bus only at a seventh one of theconnection regions 477, the second microelectronic element 30 b of thefifth microelectronic package and the second microelectronic element ofthe sixth microelectronic package 10 f are electrically coupled to theaddress bus only at an eighth one of the connection regions 478, and thefirst and third microelectronic elements of the sixth microelectronicpackage are not electrically coupled to the address bus 3. To accomplishthis, the first and third microelectronic elements 30 a, 30 c of thesixth microelectronic package can be electrically coupled to secondpanel contacts 65 b disposed at the second surface 62 of the circuitpanel 60, but the such panel contacts are not connected in anyelectrical path to the address bus 3 within the microelectronic assembly401 a.

In the examples of the microelectronic assemblies 1, 401, 401 adescribed herein having microelectronic packages 10 configured to applybalanced electrical connections to the address bus or command/addressbus 3 (through independent groups 15 a, 15 b of first terminals eachconnected to only one of the connection regions 70), the electricalloads may be distributed more evenly distributed along the signalconductors of the fly-by bus 3 compared to conventional microelectronicassemblies.

Such microelectronic assemblies 1, 401, 401 a may result in betterimpedance matching between adjacent connection regions along the bus 3,and more bandwidth capability along the bus to handle higher frequencysignals, compared to conventional microelectronic assemblies. Theinventors have found that in use, the structure of the microelectronicassemblies 1, 401, 401 a may produce significantly lower reflectioncompared to conventional microelectronic assemblies, thereby permittingthe assembly to operate at a higher bandwidth with better signaltransmission than conventional microelectronic assemblies.

In one embodiment, the connection regions 71, 72, 73, and 74 need notall be disposed on a single circuit panel. For example, connectionregions 71, 72 to which the microelectronic elements of a first package10 a are coupled can be disposed on a circuit panel other than thecircuit panel on which the connection regions 73, 74 coupled to thesecond package 10 c are disposed.

Although in the embodiments described herein, the first terminals 25 aof the microelectronic packages 30 were disposed in the central region23 of the second surface 22 of the substrate 20, in other examples, thefirst terminals can be disposed anywhere on the substrate. Although inthe embodiments described herein, the first and second sets 17 a, 17 bof the second terminals 25 b of the microelectronic packages 30 weredisposed in the peripheral regions 28 of the second surface 22 of thesubstrate 20, in other examples, the first and second sets of the secondterminals can be disposed anywhere on the substrate. Although in theembodiments described herein, the third set 17 c of the second terminals25 b of the microelectronic packages 30 were disposed in the centralregion 23 of the second surface 22 of the substrate 20, on both sides ofthe third aperture 26 c, in other examples, the third set of the secondterminals can be disposed anywhere on the substrate, and the third setof the second terminals need not be distributed on both sides of thethird aperture.

The microelectronic packages and microelectronic assemblies describedabove with reference to FIGS. 1A through 4 above can be utilized inconstruction of diverse electronic systems, such as the system 500 shownin FIG. 5. For example, the system 500 in accordance with a furtherembodiment of the invention includes a plurality of modules orcomponents 506 such as the microelectronic packages and microelectronicassemblies as described above, in conjunction with other electroniccomponents 508, 510 and 511.

In the exemplary system 500 shown, the system can include a circuitpanel, motherboard, or riser panel 502 such as a flexible printedcircuit board, and the circuit panel can include numerous conductors504, of which only one is depicted in FIG. 5, interconnecting themodules or components 506, 508, 510 with one another. Such a circuitpanel 502 can transport signals to and from each of the microelectronicpackages and/or microelectronic assemblies included in the system 500.However, this is merely exemplary; any suitable structure for makingelectrical connections between the modules or components 506 can beused.

In a particular embodiment, the system 500 can also include a processorsuch as the semiconductor chip 508, such that each module or component506 can be configured to transfer a number N of data bits in parallel ina clock cycle, and the processor can be configured to transfer a numberM of data bits in parallel in a clock cycle, M being greater than orequal to N.

In the example depicted in FIG. 5, the component 508 is a semiconductorchip and component 510 is a display screen, but any other components canbe used in the system 500. Of course, although only two additionalcomponents 508 and 511 are depicted in FIG. 5 for clarity ofillustration, the system 500 can include any number of such components.

Modules or components 506 and components 508 and 511 can be mounted in acommon housing 501, schematically depicted in broken lines, and can beelectrically interconnected with one another as necessary to form thedesired circuit. The housing 501 is depicted as a portable housing ofthe type usable, for example, in a cellular telephone or personaldigital assistant, and screen 510 can be exposed at the surface of thehousing. In embodiments where a structure 506 includes a light-sensitiveelement such as an imaging chip, a lens 511 or other optical device alsocan be provided for routing light to the structure. Again, thesimplified system shown in FIG. 5 is merely exemplary; other systems,including systems commonly regarded as fixed structures, such as desktopcomputers, routers and the like can be made using the structuresdiscussed above.

It will be appreciated that the various dependent claims and thefeatures set forth therein can be combined in different ways thanpresented in the initial claims. It will also be appreciated that thefeatures described in connection with individual embodiments may beshared with others of the described embodiments. Although the inventionherein has been described with reference to particular embodiments, itis to be understood that these embodiments are merely illustrative ofthe principles and applications of the present invention. It istherefore to be understood that numerous modifications may be made tothe illustrative embodiments and that other arrangements may be devisedwithout departing from the spirit and scope of the present invention asdefined by the appended claims.

1. A microelectronic assembly, comprising: a circuit panel having firstand second opposed surfaces and an address bus comprising a plurality ofsignal conductors electrically connected with a plurality of mutuallyexclusive connection regions, each connection region including either orboth of first panel contacts and second panel contacts electricallycoupled with at least some of the plurality of signal conductors anddisposed at the first and second surfaces, respectively; and first andsecond microelectronic packages having first terminals mounted to thefirst panel contacts and the second panel contacts, respectively, eachmicroelectronic package having first, second, and third microelectronicelements therein, each microelectronic element electrically coupled tothe address bus via only one of the connection regions, wherein thefirst and third microelectronic elements of the first microelectronicpackage are electrically coupled to the address bus only at a first oneof the connection regions, wherein the second microelectronic element ofthe first microelectronic package and the second microelectronic elementof the second microelectronic package are electrically coupled to theaddress bus only at a second one of the connection regions, and whereinthe first and third microelectronic elements of the secondmicroelectronic package are electrically coupled to the address bus onlyat a third one of the connection regions.
 2. The microelectronicassembly as claimed in claim 1, wherein the address bus is configured tocarry all address signals usable by circuitry within the first andsecond microelectronic packages.
 3. The microelectronic assembly asclaimed in claim 1, wherein each of the microelectronic elementsembodies a greater number of active devices to provide memory storagearray function than any other function.
 4. The microelectronic assemblyas claimed in claim 1, wherein an electrical characteristic between thefirst and second connection regions is within a same tolerance of theelectrical characteristic between the second and third connectionregions.
 5. The microelectronic assembly as claimed in claim 4, whereinthe electrical characteristic is an electrical trace length.
 6. Themicroelectronic assembly as claimed in claim 4, wherein the electricalcharacteristic is an electrical propagation delay.
 7. Themicroelectronic assembly as claimed in claim 4, wherein the electricalcharacteristic is a characteristic impedance of the signal conductors.8. The microelectronic assembly as claimed in claim 4, wherein theelectrical characteristic is a difference in an electrical load appliedto the address bus from the microelectronic elements connected with therespective connection region.
 9. The microelectronic assembly as claimedin claim 1, further comprising third and fourth microelectronic packageshaving first terminals mounted to the first panel contacts and thesecond panel contacts, respectively, each of the third and fourthmicroelectronic packages having first, second, and third microelectronicelements therein, each microelectronic element electrically coupled tothe address bus via only one of the connection regions, wherein thefirst and third microelectronic elements of the third microelectronicpackage are electrically coupled to the address bus only at a fourth oneof the connection regions, wherein the second microelectronic element ofthe third microelectronic package and the second microelectronic elementof the fourth microelectronic package are electrically coupled to theaddress bus only at a fifth one of the connection regions, and whereinthe first and third microelectronic elements of the fourthmicroelectronic package are not electrically coupled to the address bus.10. The microelectronic assembly as claimed in claim 9, wherein thefirst and third microelectronic elements of the fourth microelectronicpackage are electrically coupled to third panel contacts disposed at thesecond surface of the circuit panel, and the third panel contacts arenot connected in any electrical path to the address bus within themicroelectronic assembly.